Author, visionary, and legendary inventor, Joseph Fjelstad, speaks at the prestigious IEEE Aerospace Conference, in Big Sky, Montana, on March 11, 2015. Mr. Fjelstad’s presentation entitled, “Advantages of Using Aluminum Substrates for Aerospace Electronics,” offers a preview to what many technical experts view as an important and enabling near-future alternative to traditional electronics assembly. The method is one which is poised to offer dramatic increases in electronic reliability while decreasing overall cost through the elimination of solder — a cornerstone concept of Occam technology.